Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Pro BGA297 Snapdragon 778G SM7325 CPU Power NAND IC
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.