,

Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer

Availability:

Out of stock


 900

Out of stock

Compare

Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel

  1. Features
    1. 1. Brand New.
    2. Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Steel Me
    Advantage:
    1. Deformation resistant material
    2. Precise pins location

Samsung A32 stencil

3. Square round hole

4. Good material

 

  • Origin: CN(Origin)
  • Condition: New
  • Type: Logic ICs
  • Model Number: MU4
  • Application: Mobile Phone
  • Operating Temperature: 0-300
  • Supply Voltage: 1.5-5V
  • Dissipation Power: 0.5W
  • is_customized: Yes

Based on 0 reviews

0.0 overall
0
0
0
0
0

Be the first to review “Amaoe MU4 BGA Stencil MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer”

There are no reviews yet.