Amaoe SAM17 BGA Stencil Reballing For Samsung S22 S22Plus S22 Ultral S901 S906 S908 Exynos 2200 9925 SM8450 CPU
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.