- Rework help paste applied to mobile phone PCB, BGA and SMD’s PGA etc.
| - It’s used in low ionic activator system, tin-run speed.
| - Low level of smoke,surface insulation resistance value is high residue after curing.
| - Therefore, the electrical properties of the cell phones and other communications products, very little interference.
|
|
Features:- Amtech NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR.
| - Amtech Paste recommended for BGA, CSP and other solder ball array repair and fill the ball.
| - When using smoke less, no residue. Affordable.
|
|
Suitable for:- Cards, cell phone chip, video chip BGA solder, bumping.
| - Also can use off the tin, the effect is very ideal.
| - The residue was less bright spot, less smoke, no pungent odor, do not run the ball.
|
|
