JTX T4 Pro Universal Chips Glue Removal Platform Set with 3D stencils supported 85 models for Iphone Samsung EMMC RAM

JTX T4 Pro Universal Chips Glue Removal and Tin Planting Platform Set for iPhone / Samsung / Hisilicon / Android EMMC RAM

Features:

• T4 Pro degumming and tin planting platform, support Apple/Huawei /OPPO/vivo/Honor/Xiaomi/Samsung and other models a total of 85 models of chips

• The 2-in-1 design greatly helps the maintenance master to save costs and plant tin efficiency

• Magnetic automatic clamping, universal 3D planting tin net, removing the glue card, precise positioning

• Clamping precision, more stable operation, not easy to damage the chip

• Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment

• It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless and high-temperature resistance

• Selected high-quality steel, fine workmanship, wear resistance, high toughness support tin planting

• Support unlimited expansion, a total of 85 types of chips

Supported models are as follows:

• Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7150 SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845

• Dimensity: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300

• Android RAM: BGA 376, BGA 436, BGA 496, BGA 556

• Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820

• Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G

• Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17

Package includes:

• 1 x Fixture

• 13 x Stencil