MECHANIC iT3 pro Preheating Platform For iPhone X-13PROMAX Motherboard Layered/IC Chip BGA Stencil/Dot Matrix Repair
Layering, tin planting, bonding, desoldering, and glue removal are integrated, and it is equipped with controllable temperature f module expansion design I no air gun and no soldering iron I plug and play technology.
Intelligent it3 pro adjustable temperature, custom debugging temperature, debugging temperature according to different melting points.
No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
Modular design, multiple combination modules, good scalability, easy to expand new modules
Plug and play technology, the device supports hot swap, making your work more efficient
Scope of application: latest support for IP X/XS/XS Max/11/11 Pro/11 Pro Max/12 mini/12/12 Pro/12 Pro Max 13 13 mini 13 Pro 13 PRO MAX motherboard layering. Fitting. Dot matrix repair.
Type: Intelligent Desoldering Platform
Feature: 100% brand new, high quality
Feature 1: Fast heating
Feature 2: One button boot
Feature 3: Constant tempreature output
Feature 4: Work for 110/220V
Application: FOR IPHONE X XS XS MAX ip11/11pro 11promax