Mijing 3D Reball Stencil For iPhone A11/8/8p/x

Mijing 3D Reball Stencil For iPhone A11/8/8p/x BGA Reballing Soldering Repair

Feature:

• Stepped groove design enables stencil to align with the tinning position of ic rapidly.
• The square holes design makes it easier to take out the formed solder balls.
• Mijing 3D stencil is easy to use no matter you are new or an expert.
• The high success rate of planting tin, the solder balls can be formed once after you are proficient.
• Mijing 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.

Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.