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Mijing Z21 Max CPU Reballing Stencil Platform with BGA Reballing Stencil for Android


7,500

Mijing Z21 Max CPU Reballing Stencil Platform with BGA Reballing Stencil for Android

Features:

  • Automatic precise positioning
  • The new Mijing Z21 Max magnetic dynamic original positioning
  • Strong magnetic force automatic clamping
  • CPU SM8250-102
  • Hi3690 5G cpu
  • Hi 36A0 cpu
  • EMMC BGA 153 cpu
  • Hi6290/L cpu
  • HI3690 cpu
  • Hi3680 cpu
  • SM8250-202 cpu
  • Sm8350/888 cpu
  • Hi3670 cpu
  • 855/SM8150 cpu
  • 845/SDM845 cpu
  • Hi3670  cpu

Installation Method:

  • Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
  • Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)

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