AMAOE BB1 BGA Reballing Stencil Template for IPhone 6S 6SP 7P 8P 11 12 X XR XS Pro Max IP6/7/8 Baseband Tin Mesh
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.