Amaoe BGA Reballing Stencil OV8 For MTK 930MT6855V MT6833V Snapdragon 695 SM6375 CPU
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.