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Amaoe HW9 BGA Reballing Stencil Kirin710 Hi6260 For Honor 8X/20i/10/20 Lite


 900

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Amaoe HW9 BGA Reballing Stencil Kirin710 Hi6260 For Honor 8X/20i/10/20 Lite/Nova 5i/4e/3i Maimang 7 8 EMMC CPU

100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Weight 0.2 kg

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