AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Material: stainless steel