Amaoe MI10 BGA Reballing Stencil for Redmi K20 K20Pro Xiaomi 9 Series 0.12mm CPU Ram Power WIFI Audio IC Chip Tin Net Repair
Poco x3 stencil
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
PM7150A, PM8150, PM8150A, SDR8150, SM7150, SDR660,