Amaoe OV3 BGA Reballing Stencil For OPPO A3 A1 A73 A79 A83 R11 R15 MT6771/MT6763/SDM660 ViVo X20 X20i Y75 CPU EMMC Power Chip IC
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.