Amaoe-iP11 Phone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip Solder Tin Plant Net Thickness Heat 0.12mm
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.