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MECHANIC iBGA Max BGA Stencil Reballing Kit for iPhone X/XS/XS MAX/11/11 Pro/11Pro MAX

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10,550

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MECHANIC iBGA Max BGA Stencil Reballing Kit for iPhone X/XS/XS MAX/11/11 Pro/11Pro MAX Motherboard Planting Tin Fixture Platform

–Brand : MECHANIC.
–Item NO : iBGA Max.
–Size : 97*76*20mm.
–LEAK-PROOF TIN DESIGN.
–Support IPX/XS/XS MAX/11/11PRO/11PRO MAX.
–Model : Automatic positioning tin-planting platform for the mid-level motherboard.
–To prevent the tin paste dropped on other parts, Effectively protect the motherborad of mobile phones.
–Automatic positioning, No offset, Accurate and fast, So that the maintenance work efficiency is higher.

Package :
1 * BGA Reballing Platform

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