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MECHANIC Solder Paste XG-50 Soldering BGA Paste 183 degree


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MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Pb37 Welding Flux for Mobile Phone Motherboard Repair.

  • Specification:Material: Plastic + Solder
  • PasteColor: as a picture display
  • Micron: 25-45um
  • Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
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