MECHANIC UV 559 No-Clean Welding Flux BGA Solder Ball Repair Solder Auxiliary Soldering Paste For Phone PCB PGA SMD Rework
UV 559 Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals.
UV 559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.
- Flux Type: UV-559
- Volume: 10ml/10cc
- Dimension: 93 x 33 x 23mm
- Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
- Color: Yellow
- Insulated: Yes
- Application: for soldering and reballing of computer and phone chips.
- Advantage: Good immersion and high intensity joint.
- Function: for PCB , BGA , PGA reworkin.
- 100%: New Type, high quality.
shipment not included.