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MECHANIC UV 559 SOLDERING FLUX PASTE

(1 customer review)

500

MECHANIC UV 559 No-Clean Welding Flux BGA Solder Ball Repair Solder Auxiliary Soldering Paste For Phone PCB PGA SMD Rework

UV 559 Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals.

Performance:
UV 559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.
  • Flux Type: UV-559
  • Volume: 10ml/10cc
  • Dimension: 93 x 33 x 23mm
  • Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
  • Color: Yellow
  • Insulated: Yes
  • Application: for soldering and reballing of computer and phone chips.
  • Advantage: Good immersion and high intensity joint.
  • Function: for PCB , BGA , PGA reworkin.
  • 100%: New Type, high quality.

shipment not included.

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Based on 1 review

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  1. cheemafarm (verified owner)

    Good product

    cheemafarm