Mijing 3D A13 IC Chip BGA Reballing Stencil Set For Iphone 11/11 Pro/11 Pro Max
- Stepped groove design enables stencil to align with the tinning position of ic rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- Mijing 3D stencil is easy to use no matter you are new or an expert.
- The high success rate of planting tin, the solder balls can be formed once after you are proficient.
- Mijing 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.
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iphone 11 11pro 11pro max ic stencil
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