-10%
, ,

Mijing 3D A13 IC Chip BGA Reballing Stencil Set For Iphone 11/11 Pro/11 Pro Max


1,800 2,000

Mijing 3D A13 IC Chip BGA Reballing Stencil Set For Iphone 11/11 Pro/11 Pro Max

Feature:

  • Stepped groove design enables stencil to align with the tinning position of ic rapidly.
  • The square holes design makes it easier to take out the formed solder balls.
  • Mijing 3D stencil is easy to use no matter you are new or an expert.
  • The high success rate of planting tin, the solder balls can be formed once after you are proficient.
  • Mijing 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.

Shipping not included

iphone 11 11pro 11pro max ic stencil

Based on 0 reviews

0.0 overall
0
0
0
0
0

Be the first to review “Mijing 3D A13 IC Chip BGA Reballing Stencil Set For Iphone 11/11 Pro/11 Pro Max”

There are no reviews yet.