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Mijing A14 3D BGA Stencil IC Solder Reball Tin Plant Net for iPhone 12 Series


2,000

Mijing A14 3D BGA Stencil IC Solder Reball Tin Plant Net for iPhone 12 Series

Feature:

  • Stepped groove design enables stencil to align with the tinning position of ic rapidly.
  • The square holes design makes it easier to take out the formed solder balls.
  • Mijing 3D stencil is easy to use no matter you are new or an expert.
  • The high success rate of planting tin, the solder balls can be formed once after you are proficient.
  • Mijing 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.

1. This 3D stencil is easy to use no matter you are a new or expert.
2. High success rate of planting tin, the solder balls can be formed once after you are proficient.
3. This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
4. The square holes design makes it easier to take out the formed solder balls.
5. Professional and practical, compact and portable.

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