Relife RL-601W Middle Layer Planting Tin Template Platform For iPhone 13 mini/13 Pro Max Motherboard Frame BGA Reballing Stencil
Suitable for IP13/13 Mini/13 Pro/13 Pro Max
>Strong magnetic adsorption, Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
>High hardness thick synthetic stone, high temperature resistance and fast heat dissipation
>Silicone non-slip foot pads, specific weighted iron plate at the bottom effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
- Origin: CN(Origin)
- Model Number: Relife RL-601W
- Package: Bag
- is_customized: No
- Application: Motherboard Frame BGA Reballing Stencil