SAM11 Stencil BGA Reballing Stencil For Snapdragon 710 Samsung Exynos 7904 SDM710 J720/A305/G8870/G887/A40S/A8S
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Material: stainless steel