Amaoe HW10 BGA Reballing Stencil For Huawei Hi6280 CPU Hi6555 POWER Hi6353 Hi1102A BGA153 For Honor 9X/9XPro/20s/nova5/5iPro/5Z
100% brand and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.