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Amoae IPhone 11 Pro Max BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip
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ic Stencil
AMAOE MI4 Stencil XIAOMI Redmi Note 2/3/Xiaomi X MSM8956/MT6795 CPU/RAM EMMC WIFI AUDIO POWER Chip
“AMAOE SAM14 BGA Reballing Stencil Template for Samsung A105F A202F A305N A40S A505F A515F A530F A600F A750F /CPU” has been added to your cart.
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AMAOE MI4 Stencil XIAOMI Redmi Note 2/3/Xiaomi X MSM8956/MT6795 CPU/RAM EMMC WIFI AUDIO POWER Chip
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₨
600
₨
700
AMAOE MI4 Stencil XIAOMI Redmi Note 2/3/Xiaomi X MSM8956/MT6795 CPU/RAM EMMC WIFI AUDIO POWER Chip quantity
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Description
Specification
Amaoe MI4 Stencil For Redmi Note 2/3/Xiaomi X MSM8956/MT6795 CPU/RAM EMMC WIFI AUDIO POWER Chip BGA Stencil IC Solder Reballing Tin
Model Number:
MI4
FUNCTION 1::
stencils for painting
FUNCTION 2::
CPU STENCIL
FUNCTION 3::
MTK stencil
FUNCTION 4:: Reball cpu
Shipping not included.
Categories:
ic Stencil
,
Tools
Tags:
ic stencil
,
MI4
,
reball cpu
,
redmi
,
stencil
,
xiaomi
Weight
0.2 kg
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